News Update

– The presentation schedule has already been announced. Click this link to find the presenting session or click the Presentation Schedule under PROGRAM menu.

Latest update: 22 july 2024

        The 2024 International Conference on the Properties and Applications of Dielectric Materials (ICPADM) is the 14th meeting of this conference series. The IEEE Dielectrics and Electrical Insulation Society (DEIS) undertook sponsorship of the conference after the first meeting on June 24-28, 1985.

ICPADM 2024 will be held in Phuket, Thailand organized by King Mongkut’s Institute of Technology Ladkrabang Thailand

• All accepted papers for ICPADM 2024 will be included in the IEEE Xplore Digital Library

• “Best Student Paper Award” will be announced during the closing ceremony of ICPADM 2024.

• High quality papers will be invited to submit an extended version of their work for potential publication in Engineering and Technology Horizons (Formerly known as Ladkrabang Engineering Journal).

SUBMISSION OF PAPER

       The organizing committee of The International Conference on the Properties and Applications of Dielectric Materials (ICPADM) is calling for abstract submissions. The abstract and paper should be written in English using the IEEE template. The maximum word for the abstract is 500 words. The submission system will be opened on August 15, 2023. Registered and Presented papers will be published in the ICPADM 2024 Proceedings and will be submitted for inclusion in the IEEE Xplore.

REGISTRATION FEE

Registration fee includes Technical Sessions, Conference Kit, Lunches, Reception, Banquet, and Excursion. (1 Registration cover 1 paper)

– IEEE Member  700 USD per paper

– Regular  800 USD per paper

PARTICIPATION FEE – Students, Accompany and others 400 USD

IMPORTANT DATES

29 February 2024

Abstract Submission Deadline

4 March 2024

Notification for Authors

15 April 2024

Paper Submission

8 May 2024

Notification of Paper Acceptance

3 July 2024

‘Early Bird’ Registration Deadline

4-7 August 2024

Conference Dates

SUPPORTED BY

Technical Partners